A sophisticated image processing inspection tool that provides customizability and flexibility, along with reliable, highly repeatable results. The AI-enhanced software can be trained to detect defects with sparse data. Once trained, the algorithm can be imported into a production tool and the user can begin automatically classifying defects and features of interest. The system generates a defect map report of all defects detected on the wafer.
Weight
540 kg
Dimensions (W x D x H)
158 cm x 173 cm x 202 cm
Min. Vaccum Requirement
24 in. Hg (70 kPa)
Power Supply
110v/220v, 30 amps
Runs One Cassette at a Time:
25 wafers per cassette or FOUP
Standard Wafer Sizes
300, 200mm with adapter
Pre-Aligner
Illumination Modes:
Brightfield, Darkfield, DIC (Nomarski)
Light Source
White-light LED, Other options available
Objectives
2.5, 5, 10, 20, or 50x, user selectable
Travel, Typical
350 mm X and Y direction
Positioning
Linear servo motors with closed loop encoders (50 nm resolution)
Repeatability
+/- 0.5 μm
Travel Flatness
20 μm
Construction:
Precision ground raceways and high-rigidity linear guideways
Mounting Platform
Isolated platform integrated into cabinet system
Centered Load Capacity:
5 kg
AFM
SECS/GEM
OCR Camera
Air Ionizers
Automatic Wafer Handling
Multiple Resolution Settings
Rapid Scanning
Customizable Defect Reports
Wafer Mosaicing
Variety of Sample Chuck Sizes to Meet Specific Needs
Robust Analysis for Defect or Feature of Interest Detection and Classification
Inspection and Review Procedures
Multi-System Synchronization
Small Footprint and Minimal Facilities Requirements
Rack-Mount ControlsDoor Interlocks