A fully automated optical inspection system for analyzing opaque, transparent, and semi-transparent wafers for defects and features of interest.
Weight
318 kg
Dimensions (W x D x H)
153 cm x 133 cm x 176 cm
Min. Vacuum Requirement
24 in. Hg (70 kPa)
Power Supply
110v/220v, 3.5 amps
Runs One Cassette at a Time
25 wafers/cassette, Standard H-Bar Cassette
Standard Wafer Sizes
50, 75, 100, 150, or 200 mm
Dimensions (W x D x H):
71 cm x 75 cm x 35 cm
Weight
54 kg
Pre-aligner
Illumination Modes
Brightfield, Darkfield, DIC (Nomarski)
Lightsource
White Light LED (other options available)
Objectives
2.5, 5, 10, 20, or 50x, user selectable
Travel, Typical
200 mm X and Y direction
Positioning
Linear servo motors with closed loop encoders (50 nm resolution)
Repeatability
+/- 0.5 μm
Travel Flatness
30 μm
Construction
Precision ground raceways and crossed roller bearings
Mounting Platform
Microscope/heavy duty pedestal integrated into isolation table
Centered Load Capacity
2.27 kg
Weight
11.33 kg
Size (W x D x H)
35 cm x 37 cm x 4 cm
AFM
SECS/GEM
OCR Camera
Transmitted Light
Automated Wafer Handling
Multiple Resolution Settings Ranging from 0.25 μm and greater
Rapid Scanning
Customizable Defect Reports
Variety of Sample Chucks to Meet Specific Needs
Robust Analysis for Defect or Feature of Interest Detection and Classification
Inspection and Review Procedures
Multi-System Synchronization
Small Footprint and Minimal Facilities Requirements
Rack-Mount Controls